SET

À propos

SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die Bonders/Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. As a supplier of semiconductor equipment dedicated to high precision applications for over 30 years, SET has developed over 30 different types of equipment. With more than 300 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders.